Name
Si3N4 bonded SiC products
Apparent porosity
≤18
Bulk density g/cm3
≥2.60
Cold compression strength MPa
≥130
Modulus rapture at room temperature (1400)Mpa
≥39
modulus rapture at elevated temperature (1400)Mpa
≥45
Coefficient of thermal liner expansion) ×10-6/(1100)
4.18
Thermal conductivity w/(m·k) (1100)
≥15
Refractoriness ()
1800
0.2MpaLoading softening point ()
1600
Max working temperature ()
1550
(Composition)(%)
SiC
≥72
Si3N4
≥22
Fe2O3
≤0.7
Si
≤0.4