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Silicon Nitride Bonded Sic Kiln furniture
Packaging£º carton or as the customer''''s request
Infomation
  Silicon Nitride Bonded Sic Kiln Furniture

Name

Si3N4 bonded SiC products

Apparent porosity

≤18

Bulk density g/cm3

≥2.60

Cold compression strength MPa

≥130

Modulus rapture at room temperature (1400)Mpa

≥39

modulus rapture at elevated temperature (1400)Mpa

≥45

Coefficient of thermal liner expansion) ×10-6/(1100)

4.18

Thermal conductivity w/(m·k) (1100)

≥15

Refractoriness ()

1800

  0.2MpaLoading softening point ()

1600

Max working temperature ()

1550

(Composition)(%)

SiC

≥72

Si3N4

≥22

Fe2O3

≤0.7

Si

≤0.4